Technical lead - Cards & Payments (TSYS / Processor Carve-Out)

Job Description

We are seeking an experienced Technical Lead to support a strategic processor carve-out / cards platform transformation within a leading fintech/payments environment. This role requires deep expertise in card processing platforms, particularly TSYS Prime, along with strong experience in migrations or large-scale transformation programs.

Key Responsibilities:

• Lead the technical workstream for processor carve-out / card platform separation initiatives.
• Drive end-to-end migration of card portfolios, including issuing, acquiring, and transaction processing.
• Work closely with business, vendors, and technology teams to ensure seamless transition of systems and data.
• Provide expertise on TSYS Prime platform, including configuration, integration, and optimization.
• Define and oversee system architecture, data mapping, and interface design during carve-out.
• Manage UAT, system validation, and post-migration stabilization.
• Identify and mitigate technical risks, ensuring compliance with regulatory and security standards.
• Collaborate with internal and external stakeholders including processors, partners, and vendors.

Requirements:

• Strong experience working on TSYS Prime platform (mandatory).
• Proven experience in processor carve-out, card platform migration, or large-scale transformation projects.
• Deep understanding of card issuing, acquiring, and payment processing lifecycle.
• Strong knowledge of APIs, system integrations, and data migration frameworks.
• Ability to lead technical teams and manage cross-functional stakeholders.
• Experience in fintech, banks, or payment processors is essential.

Preferred:

• Prior experience in processor separation / carve-out programs.
• Exposure to regulatory and compliance frameworks in payments.
• Experience working in GCC or international markets.